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1

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Enabling the next generation USB 3.1 (Gen 2) in mobile devices

Srivastava, Nitin, Scogna, Antonio Ciccomancini, Shim, Hwanwoo

Année:

2018

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2018

2

Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures

Scogna, A.C., Orlandi, A., Ricchiuti, V.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2010

3

Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules

Teoh, Lian Kheng, Srivastava, Nitin, Shim, Hwanwoo, Boon-Kuan, Chung, Scogna, Antonio Ciccomancini

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2018

Langue:

english

Fichier:

PDF, 3.96 MB

english, 2018

4

Neurosurgery of the Peripheral Nervous System: Injuries, Degeneration, and Regeneration of the Peripheral Nerves

Eduardo Fernandez M.D., Roberto Pallini M.D., Liverana Lauretti M.D., Antonio Scogna M.D.

Journal:

Surgical Neurology

Année:

1997

Langue:

english

Fichier:

PDF, 151 KB

english, 1997

5

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - PPW Noise Mitigation in Multilayer PCBs by Means of Virtual Island And/or Array of Shorting Vias

Scogna, A. Ciccomancini

Année:

2007

Langue:

english

Fichier:

PDF, 447 KB

english, 2007

6

SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms

Kim, Kiyeong, Shim, Hwan-Woo, Scogna, Antonio Ciccomancini, Hwang, Chulsoon

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 1.44 MB

english, 2018

7

De-embedding procedure based on computed/measured data set for pcb structures characterization

Antonini, G., Scogna, A.C., Orlandi, A.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2004

Langue:

english

Fichier:

PDF, 922 KB

english, 2004

8

[IEEE 2007 18th International Zurich Symposium on Electromagnetic Compatibility - Munich, Germany (2007.09.24-2007.09.28)] 2007 18th International Zurich Symposium on Electromagnetic Compatibility - EMC simulation of complex PCB inside a metallic enclosure and shielding effectiveness analysis

Ciccomancini Scogna, Antonio, Schauer, Martin

Année:

2007

Langue:

english

Fichier:

PDF, 200 KB

english, 2007

9

[IEEE 2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects (IMWS) - Guadalajara, Mexico (2009.02.19-2009.02.20)] 2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects - Substrate integrated waveguide (SIW) filter: design methodology and performance study

Romo, G., Scogna, A. Ciccomancini

Année:

2009

Langue:

english

Fichier:

PDF, 2.65 MB

english, 2009

10

[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - Signal integrity analysis of single-ended and differential signaling in PCBs with EBG structure

Ciccomancini Scogna, A., Orlandi, A., Ricchiuti, V.

Année:

2008

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2008

11

Equivalent network synthesis for via holes discontinuities

Antonini, G., Scogna, A.C., Orlandi, A.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2002

Langue:

english

Fichier:

PDF, 945 KB

english, 2002

12

Method of Effective Roughness Dielectric in a PCB: Measurement and Full-Wave Simulation Verification

Koledintseva, Marina Y., Vincent, Tracey, Scogna, Antonio Ciccomancini, Hinaga, Scott

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2015

Langue:

english

Fichier:

PDF, 11.59 MB

english, 2015

13

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Extraction of a SPICE via model from full-wave modeling for differential signaling

Shaofeng Luan,, Selli, G., Drewniak, J.L., De Luca, A., Antonini, G., Scogna, A.C., Orlandi, A.

Année:

2004

Langue:

english

Fichier:

PDF, 316 KB

english, 2004

14

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode

Kim, Kiyeong, Shim, Hwan-Woo, Scogna, Antonio Ciccomancini, Kim, Dong-Sub

Année:

2017

Langue:

english

Fichier:

PDF, 647 KB

english, 2017

15

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - SI/PI co-optimization for LPDDR3 mobile interface

Srivastava, Nitin, Scogna, Antonio Ciccomancini, Shim, Hwanwoo, Baek, Albert, Lee, YongHyock, Kim, Dong Sub

Année:

2017

Langue:

english

Fichier:

PDF, 602 KB

english, 2017

16

Michael H. Ross (1930–2009)

Wojciech Pawlina, Kathleen Scogna

Journal:

Clinical Anatomy

Année:

2010

Langue:

english

Fichier:

PDF, 91 KB

english, 2010

17

Scalable compact models for fast design optimization of complex electromagnetic systems

Francesco Ferranti, Tom Dhaene, Luc Knockaert, Giulio Antonini, Antonio Ciccomancini Scogna

Journal:

International Journal of RF and Microwave Computer-Aided Engineering

Année:

2012

Langue:

english

Fichier:

PDF, 1.78 MB

english, 2012

18

Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes

Chuen-De Wang, Yi-Min Yu, de Paulis, F., Scogna, A.C., Orlandi, A., Yih-Peng Chiou, Tzong-Lin Wu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 2.39 MB

english, 2012

19

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Design and modeling for chip-to-chip communication at 20 Gbps

Jianmin Zhang,, Chen, Q B, Qiu, K, Scogna, A C, Schauer, M, Romo, G, Drewniak, J L, Orlandi, A

Année:

2010

Langue:

english

Fichier:

PDF, 750 KB

english, 2010

20

Neurosurgery of the Peripheral Nervous System:: Cubital Tunnel Syndrome

Eduardo Fernandez M.D., Roberto Pallini M.D., Liverana Lauretti M.D., Antonio Scogna M.D., Frank La Marca M.D.

Journal:

Surgical Neurology

Année:

1998

Langue:

english

Fichier:

PDF, 100 KB

english, 1998

21

Neurosurgery of the Peripheral Nervous System: The Posterior Interosseous Nerve Syndrome

Eduardo Fernandez M.D., Roberto Pallini M.D., Liverana Lauretti M.D., Antonio Scogna M.D., Alessandro Di Rienzo M.D.

Journal:

Surgical Neurology

Année:

1998

Langue:

english

Fichier:

PDF, 72 KB

english, 1998

22

Neurosurgery of the peripheral nervous system: entrapment syndromes of the lower extremity

Eduardo Fernandez, Roberto Pallini, Liverana Lauretti, Rossana Romani, Paolo Palma, Fabio Papacci, Antonio Scogna

Journal:

Surgical Neurology

Année:

1999

Langue:

english

Fichier:

PDF, 183 KB

english, 1999

23

Noise Coupling Mitigation in PWR/GND Plane Pair by Means of Photonic Crystal Fence: Sensitivity Analysis and Design Parameters Extraction

Ciccomancini Scogna, A., Wu, T., Orlandi, A.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2010

Langue:

english

Fichier:

PDF, 1.59 MB

english, 2010

24

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Crosstalk and delay time analysis of high density interconnects on LTCC substrate

Orlandi, A., Antonini, G., Moca, C., Scogna, A.C.

Année:

2006

Langue:

english

Fichier:

PDF, 585 KB

english, 2006

25

[IEEE 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. - Istanbul, Turkey (2003.05.16-2003.05.16)] 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. - A comparative study of PEEC circuit elements computation

Antonini, G., Ekman, J., Scogna, A.C., Ruehli, A.E.

Année:

2003

Langue:

english

Fichier:

PDF, 716 KB

english, 2003

26

[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses

Scogna, A. Ciccomancini, Orlandi, A., Ricchiuti, V., Wu, Tzong-Lin

Année:

2009

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2009

27

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - Noise Suppression in High Speed Digital Circuits by Means of a Novel EBG Structure with Triangle Patches and Hexagonal Arrays

Scogna, A. Ciccomancini

Année:

2007

Langue:

english

Fichier:

PDF, 573 KB

english, 2007

28

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - Analysis of Radiated Emissions and Shielding Effectiveness for a Metallic Enclosure with Shielding Springs

Scogna, A. Ciccomancini, Antonini, G., Orlandi, A.

Année:

2007

Langue:

english

Fichier:

PDF, 480 KB

english, 2007

29

[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - Characterization of interconnections performances for high speed digital boards: a frequency/time domain approach

Ricchiuti, V., Orlandi, A., Antonini, G., Scogna, A.C.

Année:

2003

Langue:

english

Fichier:

PDF, 314 KB

english, 2003

30

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Analysis of return path discontinuities in multilayer PCBs and their impact on the signal and power integrity

Scogna, A Ciccomancini, Bogatin, E

Année:

2010

Langue:

english

Fichier:

PDF, 947 KB

english, 2010

31

[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - Characterization of via holes discontinuities by means of numerical de-embedding

Antonini, G., Scogna, A.C., Orlandi, A.

Année:

2003

Langue:

english

Fichier:

PDF, 320 KB

english, 2003

32

[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - Study of a conformal hidden wire antenna used for the detection of stolen cars

Scogna, A. Ciccomancini, Wang, J.

Année:

2008

Langue:

english

Fichier:

PDF, 690 KB

english, 2008

33

[IEEE 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008 - Detroit, MI (2008.08.18-2008.08.22)] 2008 IEEE International Symposium on Electromagnetic Compatibility - Signal integrity analysis of a 26 layers board with emphasis on the effect of non-functional pads

Scogna, A. Ciccomancini

Année:

2008

Langue:

english

Fichier:

PDF, 533 KB

english, 2008

34

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Issues in validation of complex-valued simulations for signal integrity analysis

Duffy, A., Martin, A., Antonini, G., Scogna, A.C., Orlandi, A.

Année:

2004

Langue:

english

Fichier:

PDF, 585 KB

english, 2004

35

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - A hybrid stack-up of printed circuit board for high-speed networking systems

Zhang, Jianmin, Scogna, Antonio Ciccomancini, Fan, Jun, Archambeault, Bruce, Drewniak, James L., Orlandi, Antonio

Année:

2012

Langue:

english

Fichier:

PDF, 865 KB

english, 2012

36

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Enabling terabit per second switch linecard design through chip/package/PCB co-design

Chen, Q B, Jianmin Zhang,, Qiu, K, Padilla, D, Zhiping Yang,, Scogna, A C, Jun Fan,

Année:

2010

Langue:

english

Fichier:

PDF, 898 KB

english, 2010

37

[IEEE 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Zurich, Switzerland (2009.01.12-2009.01.16)] 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Multi Band noise mitigation in PWR/GND plane pairs by using a 2D EBG structure with square patches and meander lines

Scogna, A. Ciccomancini, Orlandi, A.

Année:

2009

Langue:

english

Fichier:

PDF, 438 KB

english, 2009

38

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Efficient design optimization of complex electromagnetic systems using parametric macromodeling techniques

Ferranti, Francesco, Antonini, Giulio, Dhaene, Tom, Knockaert, Luc, Ciccomancini Scogna, Antonio

Année:

2011

Langue:

english

Fichier:

PDF, 690 KB

english, 2011

39

[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Modeling methodologies for multi level PCB-package co-simulation & co-design

Scogna, Antonio Ciccomancini, Chiang, ChunTong, Lau, Linus, Teoh, LianKheng, Lee, HsuenYen

Année:

2013

Langue:

english

Fichier:

PDF, 123 KB

english, 2013

40

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - Stripline Simulation Model with Tapered Cross Section and Conductor Surface Profile

Scogna, A. Ciccomancini, Schauer, M.

Année:

2007

Langue:

english

Fichier:

PDF, 566 KB

english, 2007

41

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Design and optimization of LTCC digital demodulator used for aerospace satellite applications

Ciccomancini Scogna, A., Zanella, F.

Année:

2006

Langue:

english

Fichier:

PDF, 555 KB

english, 2006

42

[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - System level simulation solutions for high-speed channels - Package and PCB interface

Zhang, Jianmin, Scogna, Antonio Ciccomancini, Vincent, Tracey, Shi, Hong, Liu, Hui

Année:

2013

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2013

43

[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Efficient methodologies to study the signal integrity of multi Gb/s interconnects and full system EMC

Scogna, A. Ciccomancini, Johns, D.P.

Année:

2009

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2009

44

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Systematic analysis of the signal integrity performance of surface integrated waveguide structures (SIWs)

Scogna, A C, Orlandi, A

Année:

2010

Langue:

english

Fichier:

PDF, 656 KB

english, 2010

45

[IEEE 2008 International Symposium on Electromagnetic Compatibility - EMC Europe - Hamburg, Germany (2008.09.8-2008.09.12)] 2008 International Symposium on Electromagnetic Compatibility - EMC Europe - Performance analysis of stripline surface roughness models

Ciccomancini Scogna, A., Schauer, M.

Année:

2008

Langue:

english

Fichier:

PDF, 514 KB

english, 2008

46

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Analysis and design of GHz power noise isolation using 45° rotated photonic crystal fence

Ciccomancini Scogna, Antonio, Orlandi, Antonio, Wu, Tzong-Lin, Wang, Ting-Kuang

Année:

2011

Langue:

english

Fichier:

PDF, 3.92 MB

english, 2011

47

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Shielding performance of a metallic rack used for telecommunication equipments: FIT modeling and measurements

Année:

2006

Langue:

english

Fichier:

PDF, 315 KB

english, 2006

48

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Experimental validation of circuit models for bulk current injection (BCI) test on shielded coaxial cables

Antonini, G., Scogna, A.C., Orlandi, A., Rizzi, R.M.

Année:

2004

Langue:

english

Fichier:

PDF, 564 KB

english, 2004

49

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model

Piersanti, S., de Paulis, F., Scogna, A. Ciccomancini, Swaminathan, M., Orlandi, A.

Année:

2014

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2014

50

[IEEE 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Chicago, Il, USA (8-12 Aug. 2005)] 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Applications of FSV to EMC and SI data

Antonini, G., Scogna, A.C., Orlandi, A., Ritota, C., Duffy, A.

Année:

2005

Langue:

english

Fichier:

PDF, 466 KB

english, 2005